Another how much the PS5 will cost or what it looks like. Thanks to Sony's drip-feed of information, however, they do have some ideas.
Recently, Sony unveiled the new PlayStation 5 DualSense controller, an evolution of the former DualShock 4 with haptic and adaptive triggers which the company hopes will let players feel more immersed when performing tasks like driving cars or firing weapons in games. There have also been a small number of confirmed Microsoft seem determined to stick to their current release schedule.
Now, thanks to a new United States Patent Application (thanks, PSU) which was recently made public, fans know just a tiny bit more about the PlayStation 5, and although the patent itself doesn't give too many details about the console's external design it still provides some pretty interesting information. According to the patent's abstract summary, the PS5 heat sink will be located on the bottom of a circuit board, which will have multiple holes drilled into it for heat conduction paths. These paths will connect the heat sink to an integrated circuit apparatus which "allows for disposition of a component different from the heatsink on the same side as the integrated circuit apparatus, thus ensuring a higher degree of freedom in a component layout."
Keeping electronic components properly cooled in order to ensure their continued functionality is something which many consoles have struggled with over the years, to varying degrees of success. The overheating and noise issues, especially on the more graphically-intensive games.
Hopefully, this new PlayStation 5 patent will eventually allow for a quieter gaming experience for players. Unlike other recently revealed E3 and all other major gaming events (except for PAX) cancelled for the foreseeable future, fans will likely simply log onto the internet one day to find the PlayStation 5 staring them in the face, and only Sony knows when that day will come.
Source: US Patent & Trademark Office (via PSU)
